In a visible light camera, light can be focused on smaller size CMOS with a higher resolution. Unlike visible light, it is difficult to focus X-rays due to its shorter wavelengths. Therefore, the X-ray imaging sensor area should have to be equal to or larger than the object.
For instance, airport baggage inspection system uses a larg sensor of about 60 cm, standard size CT machine must have sensor of 90 cm, and industrial non-destructive inspection system commonly requires 40×40 cm panel. These are 100 times larger than the CMOS image sensor usded in visible light cameras.
By using latest 3D LSI technology, we have developed a seamless tiling technology to fabricate large area photon counting CdTe sensor module. That makes it superior in all substantial requirements for the X-ray imaging sensor.